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SK Hynix shipping 321-layer SSD for Dell’s AI PC
SK Hynix has initiated shipments of its PQC21 consumer SSD (cSSF)—a compact drive roughly the size of a large thumbnail—to Dell. Classified as a QLC (4 bits per cell) solid-state drive, the PQC21 features the M.2 2230 form factor (measuring 22mm by 30mm) and is equipped with a PCIe Gen 4 interface. According to SK Hynix, the drive delivers high capacity, reliable performance, and efficient power consumption. While the company has not disclosed specific IOPS or bandwidth metrics, it highlights the inclusion of an SLC (1 bit per cell) cache, which enables faster data ingestion compared to direct writing to QLC flash, a process that typically takes more time.

The PQC21 leverages SK Hynix’s latest 321-layer, triple-stack 3D NAND—part of its V9 generation—which succeeds the previous 238-layer offering. Currently available in 1TB and 2TB capacities, the SSD underscores Hynix’s focus on expanding its consumer storage lineup. The company has also stated its intention to further grow partnerships with other major global clients, hinting at potential collaborations with Lenovo and other suppliers of AI-enabled PCs.

latest company news about SK Hynix shipping 321-layer SSD for Dell’s AI PC  0

In the competitive 3D NAND landscape, SK Hynix’s 321-layer technology positions it ahead of key rivals: Samsung is currently shipping 286-layer drives, Micron offers 276-layer solutions, and Kioxia and SanDisk lag behind with 218-layer products.

QLC NAND has become a cornerstone for high-capacity SSDs, and SK Hynix’s subsidiary Solidigm— a pioneer in the high-capacity QLC SSD market—continues to push boundaries. Solidigm is currently manufacturing its D5-P5336 SSD, which uses 192-layer 3D NAND to deliver 122TB capacities. The company has plans to launch a 256TB drive by the end of this year and is actively developing next-generation 200+ layer 3D NAND technology. Notably, the D5-P5336 series also includes smaller capacity options (such as 15.36TB) with a PCIe 4.0 x4 interface, optimized for data- and read-intensive workloads across edge and core environments.

Kioxia has entered the high-capacity fray with its LC9 SSD, which boasts a 245.76TB capacity. This drive utilizes QLC 218-layer 3D NAND and 32 x 2Tb dies, with 32 dies packaged together to form an 8TB module (154BGA) measuring just 11.5mm x 13.5mm—smaller than SK Hynix’s PQC21. SanDisk, Kioxia’s joint venture partner, has announced its 256TB UltraQLC SN670 SSD, slated for shipment in the first half of this year; the drive is part of SanDisk’s new enterprise-grade UltraQLC platform, which emphasizes breakthrough capacity, performance, and power efficiency.

SK Hynix is also making strides in its own high-capacity SSD development. During a Dell Technologies forum event in Seoul last October, the company revealed its PS1101 SSD—a 245TB drive with PCIe Gen 5 connectivity. That same month, Hynix outlined three key AI NAND product directions:
  • AIN P: A high-performance SSD tailored for demanding workloads
  • AIN D: A high-density, high-capacity SSD capable of petabyte-class storage
  • AIN B: A high-bandwidth SSD designed for data-intensive tasks
The launch of the PQC21 confirms that SK Hynix is now mass-producing 321-layer QLC chips, which could potentially be integrated into the high-capacity PS1101 drive to enhance its performance and density.

Beijing Qianxing Jietong Technology Co., Ltd.
Sandy Yang/Global Strategy Director
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Pub Time : 2026-04-14 09:46:13 >> News list
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