Kioxia has released an End-of-Life (EOL) announcement for its third-generation 3D NAND products, specifically those featuring 64 layers. The notice also extends to older Floating Gate 2D (planar) NAND chips manufactured under 15nm, 24nm, and 32nm design rules.
The EOL coverage includes multiple NAND types across different technologies: SLC (32nm, 1 bit/cell), MLC (24nm and 15nm, 2 bits/cell), and TLC (15nm and 64-layer 3D NAND, 3 bits/cell). Kioxia has outlined a lengthy transition timeline: sales of these legacy products will cease after September 2026, while shipments will end by the close of 2028. This extended exit period is designed to fulfill long-term supply contract obligations and give customers ample time to migrate to newer alternatives.
The move comes amid a shifting market landscape, driven by rising demand for higher-layer TLC and QLC NAND solutions. Kioxia’s own advanced offerings—such as the 162-layer BiCS 6, along with the 218-layer BiCS 8 and BiCS 9—have gained traction, making older, lower-layer NAND less competitive. This trend also puts intermediate 3D NAND generations at risk, including the 96-layer BiCS 4 and 112-layer BiCS 5, which are increasingly overshadowed by denser, more cost-effective alternatives.
From a business perspective, Kioxia stands to gain significantly by reallocating production capacity. A NAND wafer populated with 162-layer to 218-layer chips delivers far greater value than the same wafer with single-layer planar NAND or sub-100-layer 3D NAND (including SLC, MLC, and TLC variants). By shifting fab capacity from older, less dense configurations to newer, high-layer designs, Kioxia can optimize its production efficiency, reduce cost-per-bit, and maximize revenue potential—since a single advanced wafer can yield millions more NAND bits than legacy alternatives.
This cost-efficiency and value maximization are the core justifications behind Kioxia’s decision to phase out 2D planar NAND and sub-96-layer 3D NAND production.
A separate version of Kioxia’s EOL notice details the specific product formats affected by the phase-out, providing clarity for customers relying on these legacy chips.
Kioxia’s move aligns with industry trends, as other major NAND suppliers have already made similar decisions to retire older, less dense technologies. Micron and SK Hynix have long since discontinued planar NAND production, while Digitimes reports that Samsung halted 2D NAND manufacturing in March—converting its Hwaseong Line 12 to produce DRAM instead, a shift driven by the higher value of DRAM bits compared to NAND bits.
Additionally, Samsung, SK Hynix, and Micron ceased production of sub-100-layer 3D NAND some time ago. In this context, Kioxia is playing catch-up with its competitors, as it is among the last major NAND vendors to phase out these legacy technologies.
Beijing Qianxing Jietong Technology Co., Ltd.
Sandy Yang/Global Strategy Director
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Email: yangyd@qianxingdata.com
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